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Saturday, August 4th 2007 - 17:59 CEST
Nethra Imaging has announced its second generation smart camera chips, now available in the industry’s smallest package for low power, handheld consumer devices. The NI-2065/66 programmable image processor family can be integrated into camera module designs and handsets, providing consumers with “print quality” images from less expensive optics and digital still camera functionality from their mobile phone devices. The Image Processor is currently in production and includes a JPEG encoder for enhanced compression capabilities leading to high frame rate capture, hence reducing blur and storage time. Built on 0.13-micron and boasting low power, the image processors fit into a 5mm x 6mm package.
Read: Mobile phone
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Thursday, June 7th 2007 - 21:10 CEST
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, announced that it has developed a 4GB MCP (multi-chip package) for mobile phones that for the first time forgoes the need for an external memory card slot and also eliminates having to develop interface software for all types of NAND memory. Samsung’s new moviMCP is a multi-chip package carrying an embedded (moviNAND) memory solution, which provides a simple-to-design memory package that satisfies the high-speed data transmission needs of mobile phones, while fully supporting the communication features within the handset. Samsung’s new moviMCP is currently available for OEM sampling.
Read: Samsung MCP
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Friday, April 13th 2007 - 10:06 CEST
Micron Technology unveiled a 1/4-inch, 3-megapixel complete camera system-on-chip (SOC) sensor for mobile handsets. Unique to the market, Micron has designed an anti-shake feature into the camera sensor, which greatly reduces image blurring often found in camera phone pictures due to camera shake. Blurry images are especially common in low-light situations where the shutter is open for longer periods of time to collect enough light to take the picture. A camera phone designed with Micron’s new sensor (product number MT9T111) can dramatically reduce image blur by automatically activating the anti-shake feature when sensing camera shake.
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Wednesday, February 21st 2007 - 03:02 CET
CMOS sensors are now used in cellular phones and other mobile devices, sales of these devices have been increasing rapidly. Furthermore, demand for CMOS sensors has been increasing in fields that require high-speed imaging functions, such as digital single-lens reflex cameras. While CMOS sensor advantages over CCD include lower power consumption and higher speed, their main strength is in the possibilities for system integration, since analog and digital circuits can be integrated. CMOS sensor can achieve high-speed characteristics that could not be achieved with CCD technology and can provide superb image quality that surpasses that of CCDs by taking advantage of these characteristics.
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Wednesday, February 21st 2007 - 02:30 CET
TriQuint Semiconductor, a leading manufacturer of RF front-end modules for wireless handsets, announced it is shipping production volumes of its EDGE quad-band transmit module, the TQM6M5001, to Samsung - a leading global manufacturer of wireless devices. The TQM6M5001, a member of TriQuint’s QUANTUM Tx ModuleTM family, provides full GSM / EDGE capability and shares the same footprint of its groundbreaking 6x6mm predecessor. TriQuint’s module will appear first in Samsung’s new SGH-E490 this quarter and in subsequent Samsung EDGE handsets throughout the first half of 2007.
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Wednesday, February 21st 2007 - 02:20 CET
Texas Instruments announced two devices built on the company’s leading DRP single-chip technology designed to drive affordable WLAN, Bluetooth and FM technologies into mass market handsets. The first product is WiLink 6.0, a single chip that is the latest member of TI’s mobile WLAN family, and is the industry’s first device to integrate a complete offering of mobile WLAN, Bluetooth and FM, with support for IEEE draft 802.11n for better coverage and reception. The second product is the BlueLink 7.0 solution, the latest version of TI’s BlueLink Bluetooth single-chip family that integrates Bluetooth and FM. The FM functionality in both devices delivers FM transmit and receive capabilities, turning the handset into a personal device.
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Wednesday, February 21st 2007 - 02:15 CET
STMicroelectronics, a world leader in CMOS imaging technology and the largest supplier of camera modules for mobile phones, announced a new 2-megapixel camera subsystem intended for the high-volume mainstream camera-phone market. The new VS6724 is the latest in ST's camera-on-chip family, joining the successful 1.3-megapixel VS6624 and VGA-resolution VS6524 modules. It combines a high-quality multi- element lens with a 1/4-inch CMOS sensor and on-chip processing, in a tiny industry-standard package, to deliver superb UXGA-resolution (1600 x 1200 pixels) images.
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Friday, February 16th 2007 - 23:10 CET
DxO Labs today announces a licensing agreement and a strategic cooperation with STMicroelectronics to develop and bring to market breakthrough imaging sensors and camera modules featuring DxO Digital Optics, a revolutionary embedded imaging technology. A new generation of STMicroelectronics imaging modules will feature full auto-focus functionality without any motor or moving parts, enabling DxO Digital Optics fixed lens optics to deliver sharp images from a very short distance to infinity. The resulting products will initially target the high-end mobile imaging market (3 and 5 Mpix camera modules).
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Tuesday, February 13th 2007 - 18:53 CET
At the 3GSM World Congress, Micron Technology, Inc. introduced a new line-up of image sensors that create a powerful imaging platform for next-generation camera phones. Micron’s new camera phone sensors were developed using a tiny 1.75-micron pixel design and range in resolution from 5-, 3- and 1.3-megapixel. As the imaging market share leader for handsets, Micron is focused on developing leading-edge sensor innovations and improving the camera phone experience, encouraging new uses and opportunities for the technology.




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