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Tuesday, February 4th 2014 - 19:30 CET
Panasonic is proud to introduce the new Leica DG Nocticron 42.5mm / F1.2 ASPH. / POWER O.I.S. (H-NS043) interchangeable lens for the Lumix G based on the Micro Four Thirds System standard. (35 mm camera equivalent: 85 mm). This incredible Leica DG Nocticron 42.5mm / F1.2 ASPH lens lens not only has a maximum aperture of F1.2, but it also incorporates optical image stabilization (POWER O.I.S.) along with full time Auto Focus. Certified by the world-renowned Leica, exceptional high image quality is guaranteed as well as its sophisticated metal design. The name "Nocticron" was newly defined by Leica Camera AG for this lens that achieves a remarkably fast F1.2 aperture among Micro Four Thirds digital interchangeable lenses.
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Monday, January 11th 2010 - 20:55 CET
OmniVision Technologies adds the new, feature-rich OVM7692 VGA CameraCube solution to its portfolio of ultra-compact reflowable camera modules. The OmniVision OVM7692 is a complete VGA camera solution including DVP parallel and MIPI serial output interface support, automatic luminance detection and an integrated EMI solution. The OmniVision CameraCube is designed to meet the performance and manufacturing requirements of tier-one handset manufacturers. OmniVision has already secured design wins for the OVM7692.
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Wednesday, December 9th 2009 - 18:30 CET
The IEEE International Solid-State Circuits Conference provides a view of the near future. Tomoyuki Suzuki, Senior Vice-President of Sony in Atsugi, Kanagawa, Japan, will be one of the various international speakers, and will speak about the challenges that the company is facing concerning the development of image sensors. Looking at the digital camera, a huge development has taken place. The first CCD sensors for consumer electronics were used in the mid-80's in video cameras. In the years that followed, the digital camera made its appearance and proved a great breakthrough. Several quality and performance breakthroughs became reality. The rest, as we know, is history.
Read: CMOS sensor
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Friday, November 21st 2008 - 08:20 CET
Sony announced the commercialization of "Sony IMX060PQ", a new type 1/2.5 CMOS image sensor "Exmor" for use in camera enabled mobile phones that leverages Sony's proprietary formation technology to realize the industry's smallest unit cell size (1.4µm), and the industry's highest pixel count (12.25 effective megapixel resolution). The "Sony IMX060PQ" is designed to meet the increasing need for advanced image quality within mobile phone enabled cameras. Sony also announced the launch of "IMX046PQ", a type 1/3.2 CMOS image sensor "Exmor" with 8.11 effective megapixel, and "IMX045PQ", a type 1/4 "Exmor" CMOS image sensor featuring 5.15 effective megapixel resolution.
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Friday, May 23rd 2008 - 16:30 CEST
OmniVision introduces the first 5 Megapixel camerachip sensor that incorporates its proprietary 1.75 micron OmniPixel3-HS architecture. The new OV5630 delivers best-in-class low-light performance to enable a new generation of high-performance camera phones that deliver top quality digital photography and video in a small form factor. In addition, OmniVision simultaneously launched the OV5633, a modified version of the OV5630 designed specifically for the digital still camera and digital video (DSC/DV) hybrid camera market. Both the OV5630 and OV5633 are currently sampling, with volume production expected to start in the fourth quarter of this calendar year.
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Wednesday, May 7th 2008 - 18:30 CEST
Silicon Image, a manufacturer in semiconductors for the secure storage, distribution and presentation of high-definition content, announced the availability of its 12 megapixel (MP) camera processor IP core for integration into system-on-a-chip (SoC) semiconductors. This technology delivers professional picture quality and advanced camera functionality once only found in digital still cameras (DSCs), but now conveniently integrated into cell phones, portable multimedia players (PMPs), ultra mobile PCs (UMPCs) and security cameras. Versions of this technology have already been licensed by five of the world's leading mobile phone SoC suppliers.
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Monday, December 3rd 2007 - 09:05 CET
DxO Labs announced the availability of three new embedded image processing solutions specifically designed for camera phone applications and available as silicon IP licensed to silicon vendors. These new solutions help mobile phone designers overcome the limitations of ever shrinking pixels used in high resolution, small form factor camera modules. This is accomplished by merging the best digital optics technology, also known as enhanced depth of field or EDoF, with industry-best image processing technology, including anti-aliasing demosaicing, sensor and pixel level noise compensation and DSC-class auto exposure and auto white balance.
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Tuesday, October 9th 2007 - 17:00 CEST
Toshiba America Electronic Components, Inc., a committed leader that collaborates with technology companies to create breakthrough designs, announced sample availability for a new line of ultra-compact camera modules featuring its Dynastron image sensor technology. This new family of compact camera modules with Dynastron image sensor technology, which include the TCM9200MD, TCM9100MD and the TCM9000MD, were developed using Toshiba's chip scale camera module (CSCM) manufacturing technology and are the first to use through chip via (TCV) technology. CSCM allows the mounting and assembly of camera module components in the semiconductor wafer during the module's manufacture.
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Monday, September 10th 2007 - 22:39 CEST
The 2006 image sensor market saw strong growth, due primarily to one application: camera phones, reports In-Stat. In 2006, image sensors for camera phones comprised over 3 quarters of all image sensors shipped, the market research firm says. Fueled by camera phones, CMOS sensors dominated CCDs in units shipped in 2006. “CMOS also made inroads into digital still cameras and camcorders in 2006, two markets that traditionally have been dominated by CCDs,” says Brian O’Rourke, In-Stat analyst. “CCDs continued to dominate the point-and-shoot sweet spot of the camera market. However, the growing DSLR market has been transitioning to CMOS sensors, led by Canon, which exclusively uses its own CMOS sensors.”
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Thursday, August 23rd 2007 - 08:06 CEST
Micron Technology, announced that it has designed a receiver interface into one of its new mobile imaging sensors, helping to advance 3G video phone calling. The receiver, compliant with the Mobile Industry Processor Interface (MIPI) standard, allows for the image signal processor (ISP) embedded in the sensor for the primary camera to be repurposed as the ISP engine for the secondary camera, reducing the second camera’s cost. Secondary cameras are gaining popularity as a key design feature in today’s handsets, allowing for 3G video-phone calling within designated networks.



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