Sony announced the commercialization of "Sony IMX060PQ", a new type 1/2.5 CMOS image sensor "Exmor" for use in camera enabled mobile phones that leverages Sony's proprietary formation technology to realize the industry's smallest unit cell size (1.4µm), and the industry's highest pixel count (12.25 effective megapixel resolution). The "Sony IMX060PQ" is designed to meet the increasing need for advanced image quality within mobile phone enabled cameras. Sony also announced the launch of "IMX046PQ", a type 1/3.2 CMOS image sensor "Exmor" with 8.11 effective megapixel, and "IMX045PQ", a type 1/4 "Exmor" CMOS image sensor featuring 5.15 effective megapixel resolution.

OmniVision introduces the first 5 Megapixel camerachip sensor that incorporates its proprietary 1.75 micron OmniPixel3-HS architecture. The new OV5630 delivers best-in-class low-light performance to enable a new generation of high-performance camera phones that deliver top quality digital photography and video in a small form factor. In addition, OmniVision simultaneously launched the OV5633, a modified version of the OV5630 designed specifically for the digital still camera and digital video (DSC/DV) hybrid camera market. Both the OV5630 and OV5633 are currently sampling, with volume production expected to start in the fourth quarter of this calendar year.

Silicon Image, a manufacturer in semiconductors for the secure storage, distribution and presentation of high-definition content, announced the availability of its 12 megapixel (MP) camera processor IP core for integration into system-on-a-chip (SoC) semiconductors. This technology delivers professional picture quality and advanced camera functionality once only found in digital still cameras (DSCs), but now conveniently integrated into cell phones, portable multimedia players (PMPs), ultra mobile PCs (UMPCs) and security cameras. Versions of this technology have already been licensed by five of the world's leading mobile phone SoC suppliers.

DxO Labs announced the availability of three new embedded image processing solutions specifically designed for camera phone applications and available as silicon IP licensed to silicon vendors. These new solutions help mobile phone designers overcome the limitations of ever shrinking pixels used in high resolution, small form factor camera modules. This is accomplished by merging the best digital optics technology, also known as enhanced depth of field or EDoF, with industry-best image processing technology, including anti-aliasing demosaicing, sensor and pixel level noise compensation and DSC-class auto exposure and auto white balance.

Toshiba America Electronic Components, Inc., a committed leader that collaborates with technology companies to create breakthrough designs, announced sample availability for a new line of ultra-compact camera modules featuring its Dynastron image sensor technology. This new family of compact camera modules with Dynastron image sensor technology, which include the TCM9200MD, TCM9100MD and the TCM9000MD, were developed using Toshiba's chip scale camera module (CSCM) manufacturing technology and are the first to use through chip via (TCV) technology. CSCM allows the mounting and assembly of camera module components in the semiconductor wafer during the module's manufacture.

The 2006 image sensor market saw strong growth, due primarily to one application: camera phones, reports In-Stat. In 2006, image sensors for camera phones comprised over 3 quarters of all image sensors shipped, the market research firm says. Fueled by camera phones, CMOS sensors dominated CCDs in units shipped in 2006. “CMOS also made inroads into digital still cameras and camcorders in 2006, two markets that traditionally have been dominated by CCDs,” says Brian O’Rourke, In-Stat analyst. “CCDs continued to dominate the point-and-shoot sweet spot of the camera market. However, the growing DSLR market has been transitioning to CMOS sensors, led by Canon, which exclusively uses its own CMOS sensors.”

Micron Technology, announced that it has designed a receiver interface into one of its new mobile imaging sensors, helping to advance 3G video phone calling. The receiver, compliant with the Mobile Industry Processor Interface (MIPI) standard, allows for the image signal processor (ISP) embedded in the sensor for the primary camera to be repurposed as the ISP engine for the secondary camera, reducing the second camera’s cost. Secondary cameras are gaining popularity as a key design feature in today’s handsets, allowing for 3G video-phone calling within designated networks.

Nethra Imaging has announced its second generation smart camera chips, now available in the industry’s smallest package for low power, handheld consumer devices. The NI-2065/66 programmable image processor family can be integrated into camera module designs and handsets, providing consumers with “print quality” images from less expensive optics and digital still camera functionality from their mobile phone devices. The Image Processor is currently in production and includes a JPEG encoder for enhanced compression capabilities leading to high frame rate capture, hence reducing blur and storage time. Built on 0.13-micron and boasting low power, the image processors fit into a 5mm x 6mm package.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, announced that it has developed a 4GB MCP (multi-chip package) for mobile phones that for the first time forgoes the need for an external memory card slot and also eliminates having to develop interface software for all types of NAND memory. Samsung’s new moviMCP is a multi-chip package carrying an embedded (moviNAND) memory solution, which provides a simple-to-design memory package that satisfies the high-speed data transmission needs of mobile phones, while fully supporting the communication features within the handset. Samsung’s new moviMCP is currently available for OEM sampling.

Micron Technology unveiled a 1/4-inch, 3-megapixel complete camera system-on-chip (SOC) sensor for mobile handsets. Unique to the market, Micron has designed an anti-shake feature into the camera sensor, which greatly reduces image blurring often found in camera phone pictures due to camera shake. Blurry images are especially common in low-light situations where the shutter is open for longer periods of time to collect enough light to take the picture. A camera phone designed with Micron’s new sensor (product number MT9T111) can dramatically reduce image blur by automatically activating the anti-shake feature when sensing camera shake.