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Power efficient - Efficient chips
"Anticipating the increasing need for energy-conserving, power-efficient products, we have made great strides in getting laptops and mobile devices to run faster and longer by aggressively pursuing the development of more efficient chips," said Kevin Lee, Vice President, Memory Marketing Samsung Semiconductor, Inc.
Energy efficiency & Better user experience
"We have challenged our R&D teams to develop new displays based on advanced technology that will not only produce better user experiences, but at the same time, improve the energy-efficiency of consumer electronics," added Scott Birnbaum, Vice President, Samsung LCD Business.
Mobile devices - Energy saving advancements
Over the past seven months, Samsung Semiconductor has made major energy-saving advancements in a wide range of components that together have a substantial effect on prolonging battery life. These include flash memory, lcd panels, logic, DRAM, and chip packaging;
Samsung Flash Memory
Solid State Drives (SSDs) that consume a third of the laptop power (.5W) consumed by comparably-sized hard disk drives (1.5W)
Samsung LCD Panels
2.1-inch LCD screens that extend battery life in mobile phones by automatically adjusting the screen brightness to reduce the amount of backlighting when ambient lighting is already sufficient.
Samsung Logic
System-on-Chips (SoCs) for hybrid hard drives (HHDs) that reduce laptop power consumption up to 80 percent compared to conventional hard disk drives. And embedded DRAM featuring a 40 percent power reduction in mobile devices when designed into SOCs, such as Samsung's DV-1 chip, for use in mobile devices including next generation smart phones, portable music players and handheld PDAs.. And CMOS Image Sensors (CIS) for mobile phone cameras that use 1/10 the power of widely used charged coupled device (CCD) image sensors, thereby reducing battery consumption and power charges, while prolonging the usage span of CE devices such as mobile phone cameras and digital still cameras..
Samsung DRAM
New Mobile DRAM chips (using an 80-nanometer production process) with temperature-sensors that reduce mobile phone power drain by more than 30 percent. And DDR3 memory chips that use only 1.5V of power and adopt improved circuit designs with a reduction in power consumption by more than 20 percent over DDR2.
Samsung Chip Packaging
A new wafer-level-processed stacked packaging technique that reduces current leakage in multi-stack memory packages another 30 percent. In the future, Samsung will deliver even more power savings for laptops and mobile devices with new generations of "fusion memory" chips, such as the OneDRAM chip developed earlier this year.










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